Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
The Giga-snap SFS-BGA200B-52 socket allows an 11 x 14.5-mm, 200-ball BGA IC with a 0.65-mm pitch, 12 x 22-array to be placed in a socket with the same footprint as the IC to avoid compromising ...
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