This paper will address the optimization of Pb Free soldering conditions, with a focus on differences between Sn/ Pb and Pb Free soldering. This allows assemblers to build on their extensive ...
Reliability of the microelectronic interconnection materials for electronic packages has a significant impact on the fatigue properties of the electronic assemblies. This is due to the correlation ...
X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...