Semiconductor Engineering

Automated Multiphysics For Successful 3D-IC Design

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...
New Electronics

Siemens introduces multiphysics cockpit for 3D IC design and verification

Siemens Digital Industries Software has introduced Innovator3D IC, new software that can deliver a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets. For ...
Design-Reuse

Siemens streamlines design and analysis of complex, heterogeneously integrated 3D ICs

New Innovator3D IC suite enables faster design completion with capacity, performance, compliance and data integrity Calibre 3DStress delivers early analysis/simulation of chip/package interactions at ...
Electronic Design

Siemens Helps Understand Heat Inside 3D Chip Designs—and Out

Today, most of the big names in the semiconductor industry are racing into the era of the 3D IC, strapping heterogeneous dies directly on top of each other to improve performance without increasing ...
Semiconductor Engineering

The Computational Electromagnetics Simulation Challenge Of 3D-IC

Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...
Dataquest

Siemens streamlines design and analysis of complex, heterogeneously integrated 3D ICs

Siemens Digital Industries Software introduced two new solutions to its electronic design automation (EDA) portfolio that help semiconductor design teams address and overcome the complexity challenges ...