Learn about the digital engineering platform that the DOD intends to use to accelerate the development of integrated circuits ...

Cyient DLM, an integrated partner for design-led manufacturing, has signed a production contract with Boeing Global Services (BGS) for precision-machined ...

The global ball grid array (BGA) packaging market is poised for steady growth, with market size projected to reach USD 1.29 ...

Microchip has combined a chip-scale caesium atomic clock for good accuracy with a ovened crystal oscillator for good phase noise, in a through-hole package measuring 0.4 x 50.4 x 12.7mm (2 x 2 x ...

If you're looking to dig into the world of hi-fi systems that consist of a separate stereo receiver or integrated amplifier that powers a set of passive speakers — whether your passion is ...

Plus, Bad Bunny banks three new Hot 100 top 10s, led by "DtMF" at No. 2. By Gary Trust Lady Gaga and Bruno Mars’ “Die With a Smile” secures a third total and consecutive week at No. 1 on the ...

On January 15, 2025, the US Department of Commerce Bureau of Industry and Security (BIS) published an interim final rule (IFR) that imposes new controls on advanced computing integrated circuits ...

This research introduces a new bare-die embedding PCB packaging technology, ensuring a very compact, high power density, and integrated design for the power electronics unit. The design incorporates ...