2024 | News | DISCO Corporation
Dec 10, 2024 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools …
About DISCO | DISCO Corporation
User Agreement Use of the DISCO Corporate Name Guarantee policy for customer using DISCO Products Policy for Process Support Policy regarding the use of cloud services Using DISCO's …
2025 | News | DISCO Corporation
Jun 2, 2025 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools …
What kind of company is DISCO? | DISCO Corporation
DISCO’s current main customers are semiconductor and electrical components manufacturers, who manufacture products at their own factories using DISCO equipment and processing tools …
株式会社ディスコ - DISCO
DISCO Technical Review Kiru（切る）・Kezuru（削る）・Migaku（磨く）技術に関する技術見解・ 論文のページです。
DISCO Corporate History | About DISCO | DISCO Corporation
Since DISCO had transformed itself from a small abrasives shop to a leading manufacturer of precision processing tools and equipment and because the character of the company had …
DISCO Corporation
Introduction to DISCO solutions that help customers tackle issues concerning Kiru・Kezuru・Migaku processes, including technical know-how, test cuts, and processing services.
DGP8761 | Polishers | Product Information | DISCO Corporation
The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment. In addition, the operation method …
KABRA｜DISCO Corporation
This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the …
Investors | DISCO Corporation
IR News News Disaster Information Stock DISCO Dividend Payout for Fiscal Year 2025 2025/10/29 Results Business Forecast Notification 2025/10/29